Hitachi Chemical (Shanghai) Co., Ltd.

This is a film type resist that is which applied onto the copper-clad laminate to create circuits for the printed wiring boards.This features high sensitivity,high resolution, and high adhesion with strong tenting ability to create high density patterns.

Hitachi Chemical was the first company in the world to develop these circuit connecting materials for displays.They satisfy both conductivity and insulation performance owing to adhesives with conductive particles,enable the connection of numerous minute electrodes at a time, and are used widely in devices such as PCs, cell phones,LCDs,and plasma TVs.

Encapusulation materials are packaging materials that protect semiconductor chips from heat,moisture,dust and physical impacts. While responding packaging and environmental issues,we offer products that meet our customers' requirements.

These materials are made by impregnating glass cloth with epoxy resin and then laminating copper foil on both sides,and are used in multilayer printed wiring boads.The high-Tg glass epoxy copper-clad laminates maintain excellent FR-4 characteristics and at the same time realize high heat resistance and low moisture-absorption.

Excellent moisture-resistance enables these products to protect electrodes in such devices as LCDs from moisture.Since the coating has low moisture-permeability and few ionic impurities,it demonstrates excellent migration resistance and contributes to the reliability of the finished devices.

FH series is a two-in-one film with the functions for both dicing tape and die bonding film. Enabling both tapes to be laminated to a wafer at one time, it has achieved easy handling of thinner wafers.